Journal: Microsystems & Nanoengineering

Article Title: Concept and proof for an all-silicon MEMS micro speaker utilizing air chambers

doi: 10.1038/s41378-019-0095-9

Figure Lengend Snippet: a Assembled device with cover wafer on top showing its acoustic openings; the MEMS chip is glued to a carrier board enabling wire bonds for electrical contacting. The chip actually comprises three different micro speakers, which were not diced for this test set-up. The middle one was used as shown in ( a ). b Side view of the bonded wafer stack showing the three wafers and their thicknesses. Scallops resulting from cleavage through lacer dicing are clearly visible. c Measurement and modeling results for the SPL. Device was driven with u dc = 40 V and u ac = 10 Vpp. An SPL of 69 dB was achieved at 500 Hz. d THD measurement and modeling. THD value at 500 Hz is 4.4%. e Sequence of stroboscopic pictures from the holographic microscope showing three consecutive (time wise) deflections states in resonance of one actuator pair (specimen without cover wafer)

Article Snippet: For comparison, pure electromechanical measurements have also been carried out using a digital holographic microscope (Lyncee Tec R-2203).

Techniques: Sequencing, Microscopy

Journal: ACS Applied Materials & Interfaces

Article Title: Multiscale Hierarchical Surface Patterns by Coupling Optical Patterning and Thermal Shrinkage

doi: 10.1021/acsami.0c22436

Figure Lengend Snippet: (a) Diffraction efficiency curve for the inscription of an azopolymer (SRG) with ca. 1 μm period. (b) Digital holographic microscopy (DHM) phase image of the same SRG and the average surface profile.

Article Snippet: Surface relief gratings were characterized via reflection digital holographic microscopy (DHM R-2100, Lyncee tec., Lausanne, CH).

Techniques: Digital Holographic Microscopy